Item 1. Business" -->
| Item 1. | Business |
Certain statements in this Annual Report on
Form 10-K
are forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933, as amended (the
Securities Act), and Section 21E of the
Securities Exchange Act of 1934, as amended (the Exchange
Act). These statements involve a number of risks,
uncertainties and other factors that could cause our actual
results, performance or achievements to be materially different
from any future results, performance or achievements expressed
or implied by these forward-looking statements. Factors which
could materially affect such forward-looking statements can be
found in the section entitled Risk Factors in
Part 1, Item 1A. in this Annual Report on
Form 10-K.
Investors are urged to consider these factors carefully in
evaluating the forward-looking statements and are cautioned not
to place undue reliance on such forward-looking statements. The
forward-looking statements made herein are only made as of the
date hereof and we will undertake no obligation to publicly
update such forward-looking statements to reflect subsequent
events or circumstances.
References in this Annual Report on
Form 10-K
to Eagle Test, the Company,
we, us or our are to Eagle
Test Systems, Inc., a Delaware corporation, and its
subsidiaries.
Overview
We design, manufacture, sell and service high-performance
automated test equipment, or ATE, for the semiconductor
industry. Our test equipment is designed to address our
customers volume production needs and to enable them to
achieve low cost-of-test per device. Our customers, including
semiconductor manufacturers and assembly and test
subcontractors, use our products to test analog, a combination
of digital and analog, known as mixed-signal, and radio
frequency, or RF, semiconductors. Our proprietary
SmartPintm
technology enables multiple semiconductor devices to be tested
simultaneously, or in parallel, on an individual test system,
permitting greater test throughput. We believe that our
technology and ATE architecture offer significant test speed and
precision, leading to high production yields and repeatable
results. Our modular and scalable test systems are designed to
provide our customers with cost-efficient, customized solutions.
Semiconductors tested by our systems are incorporated into a
wide range of products in high-growth markets, including digital
cameras, MP3 players, cellular telephones, video/multimedia
products, automotive electronics, computer peripherals, and
notebook and desktop computers.
Semiconductor manufacturers continuously strive for
manufacturing and process improvements in order to satisfy the
demand for smaller, better performing and lower cost
semiconductors. Semiconductor manufacturers are aggressively
pursuing strategies to reduce their overall cost-of-test by
increasing the throughput of their test systems. Cost-of-test
includes the initial ATE and ancillary equipment purchase price,
as well as
set-up and
operating costs, and is often the most significant manufacturing
cost, particularly for high-volume, low-cost devices. For these
types of devices, ATE throughput, or the number of devices that
can be tested in a given unit of time on a single test system,
is a key determinant of cost-of-test per device and of a
manufacturers ability to compete profitably.
We were founded and began providing test solutions in 1976.
Since October 1, 2003, we have delivered over 900 test
systems to more than 70 customers worldwide including Allegro
MicroSystems, Inc., Carsem Sdn. Bhd, Fairchild
Semiconductor International, Inc., Infineon Technologies,
Intersil Corporation, National Semiconductor Corporation, ON
Semiconductor Corporation, STMicroelectronics N.V., Texas
Instruments Incorporated and UTAC Thai Ltd. Our global
headquarters and manufacturing facility is located in Buffalo
Grove, Illinois which opened in January 2005. We operate sales,
services and engineering support facilities in the United States
through regional offices and globally through our offices in
Korea, Singapore, Taiwan, Italy, Germany, China, Malaysia and
the Philippines. We completed our initial public offering on
March 14, 2006.
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Industry
Background
Semiconductor devices are the foundation of the modern
electronic world. Semiconductors are typically divided into two
broad categories, digital and analog. Digital semiconductors,
such as microprocessors, digital signal processors, or DSPs, and
memory devices, are used to process and store data in a binary
format using electrical signals to represent the binary digits,
1 and 0. In contrast, analog
semiconductors, such as amplifiers, RF devices, voltage
regulators and other power management devices, are used to
measure, control and transform physical properties, such as
light, sound and movement, into a digital format by producing
electrical signals that have a continuous range of values.
Mixed-signal semiconductors contain both analog and digital
elements on a single device but are generally classified as
analog semiconductors.
Semiconductor prices typically decline as new devices are
introduced and as devices advance through their product life
cycles. This price compression takes place against a backdrop of
increasing device complexity. Consequently, semiconductor device
manufacturers, especially those serving high-volume markets,
must continually seek cost reductions in all aspects of their
manufacturing process.
The
Importance of Testing in Semiconductor Production; The ATE
Market
The process of designing and manufacturing semiconductors is
complex and capital intensive. The wafer fabrication process, or
front-end process, involves numerous and repetitive
processing steps during which hundreds or even thousands of
copies of a device are formed simultaneously on a single wafer.
The subsequent testing and assembly of devices into packaged
products ready for sale is commonly referred to as the
back-end process.
Device testing is a critical part of the semiconductor
production process and is a significant component of the cost of
manufacturing semiconductors. Test equipment is typically used
in the back-end process where each device is often tested
several times to validate functional and electrical performance
prior to shipment. ATE is generally used in two steps in the
back-end semiconductor production process:
| | Wafer Probe Test. After wafer fabrication, a test system performs electrical testing of individual devices while still in wafer form for initial pass/fail verification by moving the wafer into contact with a wafer probe card. Semiconductors are tested at this stage to avoid the additional costs associated with assembling, packaging and further testing of defective semiconductors. | |
| | Final Test. After the individual semiconductor devices, called die, that fail the wafer probe test are discarded, the remaining die are assembled into packages. Manufacturers then test the packaged devices over a range of potential operating conditions to measure their functionality against precise performance specifications. Final test works to ensure that a device meets the manufacturers quality standards prior to shipping. |
In addition to identifying devices that do not function properly
in the back-end process, ATE also generates information that
semiconductor manufacturers use to improve the yield of their
overall production process and to assist in the semiconductor
design and development phase. Demand for ATE is driven by
increases in semiconductor unit production, increases in the
complexity of semiconductor devices and the need to improve the
overall cost-effectiveness of the semiconductor manufacturing
process.
Current
Test Challenges
Device manufacturers have continually focused on manufacturing
and process improvements to satisfy the demand for smaller,
better performing and lower cost semiconductors. Technological
advances, such as smaller device geometries, higher transistor
density and the introduction of larger, 300 mm wafers, have led
to significant economies of scale in the front-end process and a
general decline in overall manufacturing cost per device.
However, as front-end costs have been decreasing, back-end
costs, of which testing costs can be the most significant
component, have not enjoyed the same rate of improvement. As a
result, test cost has become a growing percentage of overall
manufacturing cost and can be the most significant cost
associated with manufacturing a semiconductor, especially in the
case of high-volume devices. Consequently, semiconductor
manufacturers are aggressively pursuing strategies to reduce
their overall cost-of-test.
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In analyzing total cost-of-test, semiconductor manufacturers
focus on the initial ATE purchase price, equipment throughput,
the range of products that can be effectively tested, costs
associated with test application development, ability to
upgrade, on-going maintenance and training requirements, and the
need for ancillary equipment and floor space. Reducing the total
cost-of-test is an important consideration for all device
manufacturers, but is of particular significance to vendors of
high-volume, low-cost devices for whom overall manufacturing
cost is a critical factor in the ability to compete profitably.
Significant challenges for device manufacturers in achieving
lower overall cost-of-test include:
| | Need for High Throughput Testing. A test systems throughput, or the number of devices that can be tested on a single test system in a given period of time, is a principal driver of cost-of-test. Improving throughput allows semiconductor manufacturers to meet increased capacity demands with fewer test systems, and consequently less ancillary equipment. The most effective method of increasing test throughput is to test multiple devices simultaneously on the same test system, or in parallel, on multiple test sites. The benefits are lower overall capital expenditures and less required floor space for a given increment of capacity. Although this multi-site, parallel test approach is widely employed for high volume production of digital and memory devices, it has proved challenging for analog and mixed-signal device testing due to the nature of the electrical properties of analog devices and the current architecture of many analog and mixed-signal test systems. | |
| | Need for Greater Testing Accuracy and Repeatability. The percentage of functioning devices per production run, known as yield, is a key measurement in determining the cost of semiconductor manufacturing. While yield losses can occur at multiple points during the manufacturing process, yield can be particularly affected during the testing process when functioning, or good, devices are deemed bad by test equipment incapable of making high precision measurements. Since lower yields have a direct impact on profitability, semiconductor manufacturers seek test equipment capable of highly accurate, repeatable results. Greater precision increases the likelihood that good devices will pass and defective devices will fail. In multi-site testing, test accuracy and repeatability can be compromised when electrical signals from a device failure from one site influence the test results at another site. This occurs in conventional test systems because the test instrumentation connected to each device under test, or DUT, is electrically linked by a common signal and power pathway, known as a common ground pathway, in the test system. For this reason, semiconductor manufacturers seek test solutions capable of producing precise, repeatable results and that minimize undesired interaction between devices undergoing simultaneous multi-site test. | |
| | Demand for Scalable, Flexible Solutions. ATE providers have traditionally offered test systems that emphasize solutions for the most advanced semiconductors, such as those with high digital pin counts and high operating frequencies. The challenges associated with testing these complex devices have resulted in test systems that are increasingly expensive to acquire, operate and maintain. Often, the functionality of these test systems greatly exceeds the test requirements for many low-priced, high-volume devices and cannot be scaled down in a cost-effective manner to address the specific requirements of these particular devices. In other cases, the test equipment offered at lower prices has proven incapable of providing the multi-site, parallel test capability required to achieve high throughput. Due to the lack of flexibility in traditional ATE architecture, semiconductor manufacturers require test equipment with the capability to cost-effectively scale functionality to meet the test requirements of a wide range of devices. | |
| | High Cost of Changing Test Platforms. Although more cost-effective test platforms may be available for testing many devices, the costs associated with migrating, or switching, to a new platform are often significant enough to cause semiconductor manufacturers to stay with their current, less efficient, test platforms. The switching costs associated with replacing an existing test solution include the capital expense of the new test system, the cost of developing and integrating new test programs and associated hardware, the expense associated with investment in ancillary hardware and other accessories, and the re-training and facility improvements necessary to support the new ATE environment. In addition, switching costs decrease the overall efficiency of the test process due to the increased time required for engineering and production staff to evaluate and validate new test systems. These high switching costs |
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| often make semiconductor manufacturers reluctant to switch to a new test platform, despite the new platforms ability to provide higher throughput and lower cost-of-test. |
Our
Solution
Our products are designed to enable our customers to achieve low
overall cost-of-test per device. We believe our test systems
deliver increased test throughput for high-volume,
price-sensitive semiconductors in the analog, mixed-signal and
RF markets. We offer test systems that enable our customers to
achieve a high level of test accuracy and repeatability, and our
flexible system architecture can be easily reconfigured and
adapted to meet our customers current and evolving testing
needs. By focusing on low cost-of-test per device and based on
informal feedback from customers, we believe that our test
systems offer customers a competitive overall test solution that
enables them to lower their semiconductor production costs and
improve their profit opportunity. The aspects of our solution
that facilitate low cost-of-test include:
Increased Throughput. Our test systems are
designed to enable our customers to improve throughput, which
lowers total cost-of-test. We improve throughput in the
following manner:
| | Our proprietary SmartPintm technology shortens the time required to complete the test routine for each individual device. SmartPintm technology enables high-speed, sequential subtests in which the test instrumentation completes an entire range of test parameters without software intervention or the time consuming task of opening and closing relays. In addition, with onboard DSP processing technology, SmartPintm eliminates the need for data and test results to cross long signal paths in order to be collected and analyzed. | |
| | Our test systems optimize simultaneous, or parallel, testing across multiple sites on the same test system. We refer to this capability as SimulTesttm. Our architecture enables test routine replication across multiple sites by dedicating signal sourcing and measurement resources, for current and voltage, and local signal processing to each pin on the DUT. This permits one test system to effectively test multiple devices simultaneously, which is critical for cost-efficient, multi-site, parallel testing. |
Improved Yield with Precision and
Repeatability. Our proprietary technology and
product architecture are designed to achieve test precision and
repeatable results in order to deliver higher yields. We believe
our solution improves yield in the following ways:
| | Our equipment allows customers to perform tests with a high degree of precision by narrowing the range of test tolerances, or guard bands. Reduced guard bands improve yield by allowing device manufacturers to measure closer to the established performance limits of the device. | |
| | The analog resource boards in our test systems are designed with independent computer interfaces, power supplies and independent ground connections that eliminate the need for a shared communication and electrical pathway. By avoiding the use of a common ground pathway, the test results from one device are isolated and avoid undesirable interactions with devices undergoing simultaneous test within the same test system. |
Scalable and Flexible Architecture. Our test
system architecture is designed to enable our customers to
quickly and cost-effectively upgrade or reconfigure their test
systems as their testing needs evolve. Our architecture offers
the following benefits:
| | Our test instruments, or resource boards, provide dedicated functionality and capability, which allow customers to tailor their test system capabilities to the specific testing needs of their devices. Our ATE is designed utilizing modular hardware and off-the-shelf electrical components that allow us to develop new features at the resource board level in a short time period. Our architecture also enables customers to upgrade their test system capability by simply adding another board or replacing an existing board within an existing test system. This is a more cost efficient and less time consuming approach than replacing the entire test system, as is required by many competing systems. | |
| | A majority of our analog resource boards can be employed in any of the test platforms we offer, allowing our customers to utilize identical hardware across our entire product line. This approach offers |
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compatibility across a wide range of products, as well as easy
replacement and support of individual resource boards. In
addition, our entire test system product line operates under a
uniform software environment, allowing customers to move
seamlessly to different test system types by utilizing a common
operating environment.
Lower Switching Costs. We have developed a
proprietary, adaptable interface that enables our test systems
to operate using other vendors DUT boards, as well as
earlier generations of our DUT boards, which is a significant
advantage to us as our customers testing needs change.
This proprietary architecture, which we call
Chameleontm
technology enables customers to easily migrate from some
competing test platforms or earlier generations of our own
product line, to a newer and more cost-effective Eagle Test
solution. Our test systems are designed to offer customers a
low-cost and time-saving option for migrating test platforms.
During the sales process, prospective and existing customers
generally engage in an evaluation process in which they compare
the costs and test results, such as yield and repeatability, of
their current test solution against our proposed test solution.
The customers current test solution may consist of a test
system provided by one of our competitors, such as Credence
Systems Corporation, LTX Corporation or Teradyne, Inc., a test
system internally developed by the customer, or one of our
previous generation test systems. An important consideration in
the comparative evaluation process is the overall cost-of-test,
which includes factors such as the number of devices to be
tested, the total test system acquisition cost, the amount of
required floor space, test time and the number of test systems
required, and also considers system flexibility, upgradeability
and maintenance costs. Customers often share with us their
conclusions from their comparative evaluation of the
cost-of-test of their current test solution versus our proposed
test solution. This feedback, together with our experience with
customers selecting our test solution after employing this
evaluation process, supports our belief that our test systems
often provide a low cost-of-test, as compared to the
customers current test solution. We believe that in most
cases in which a customer decides to switch to our proposed test
solution, the customer has concluded that the cost of switching
to a new test platform is outweighed by the reduction in the
overall cost-of-test. In addition, customers also consider other
relevant factors, such as service and technical support
capabilities, brand awareness, financial viability and
production capacity.
Our test systems are currently not designed to address the test
requirements of semiconductors with large digital content, such
as memory devices or microprocessors, which are typically tested
by more costly test systems with different capabilities.
Products
Test
Systems
We design, manufacture, sell and service a family of
high-performance test systems that test analog, mixed-signal and
RF semiconductors. Our current products are designed to provide
our customers with the optimal level of test performance and
functionality for their particular testing needs. The following
table sets forth our current product offerings, their features
and the devices tested by each product.
|
Data |
||||||||||||||||||||||||||||||
|
Index |
Conversion |
|||||||||||||||||||||||||||||
|
Analog |
Digital |
RF |
Multi-Site |
Parallel |
Power |
RF and |
and Video |
Complex |
Precision |
|||||||||||||||||||||
|
Test Systems
|
Channels | Pins | Ports | Capability | Capability | Management | Wireless | Processing | Automotive | Mixed-Signal | Linear | Discretes | ||||||||||||||||||
|
ETS-600
|
480 | 256 | 32 | 64 | ü | ü | ü | ü | ü | ü | ||||||||||||||||||||
|
ETS-364
|
240 | 128 | 16 | 64 | ü | ü | ü | ü | ü | ü | ||||||||||||||||||||
|
ETS-300
|
240 | 32 | | 32 | ü | ü | ü | |||||||||||||||||||||||
|
ETS-200
|
120 | 16 | | 16 | ü | ü | ü | |||||||||||||||||||||||
|
ETS-200T
|
48 | | | 16 | ü | |||||||||||||||||||||||||
|
ETS-200T-FT
|
48 | | | 16 | ü | ü | ||||||||||||||||||||||||
ETS-600 and ETS-364. Introduced in 2001, the
ETS-600 and ETS-364 offer our highest performance analog,
mixed-signal and RF test platforms across a broad range of
semiconductors. The systems were designed to maximize throughput
capability by enabling
SimulTesttm
multi-site testing for up to 64 sites, through our
SmartPintm
technology, our highest digital capabilities, and our custom
designed RF6000
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architecture. The RF6000 is a resource board and accessory to
the ETS-600 or ETS-364 that enables the tester to simultaneously
source and measure RF signals across multiple RF devices in a
fully calibrated environment through the use of a proprietary RF
Source Distribution Module. This functionality allows users to
distribute RF source signals simultaneously to multiple device
ports and calibrate each port to ensure that each port receives
the precise desired RF signal to each device. The RF6000s
unique measurement capabilities are achieved through the use of
RF signal down converters per port, which allow
users to simultaneously measure the RF signal output of each RF
device under test. These key features minimize RF device test
times in multi-site applications by avoiding unnecessary
switching between RF signal source and measurement functions
while maintaining the signal integrity needed in an RF test
environment.
The ETS-600 delivers our highest level of performance and
functionality with up to 256 digital pins, over 480 analog
channels, and up to 32 RF ports. The ETS-364 delivers up to 128
digital pins, over 240 analog channels, and up to 16 RF ports.
The ETS-364 was designed to be fully compatible with the ETS-600
test system. Utilizing a common DUT interface and software
command structure, the ETS-600 and ETS-364 offer customers a
natural migration path between medium and large-scale,
multi-site testing.
ETS-300 and ETS-200. We introduced the ETS-300
and ETS-200 in 1998 as low-cost, high-performance analog and
mixed-signal test systems. The ETS-300 delivers up to 32 digital
pins and over 240 analog channels. This system offers
SimulTesttm
multi-site testing with up to 32 site capability. The ETS-300 is
an attractive solution for analog applications and applications
requiring less significant digital capabilities for testing
devices such as switching regulators, power factor controllers,
and various automotive devices.
The ETS-200 serves a similar market, but delivers up to 16
digital pins and up to 120 analog channels of throughput. The
ETS-200 offers
SimulTesttm
multi-site testing with up to 16 site capability. The ETS-200 is
intended for targeted applications such as operational
amplifiers, low dropout regulators, and other analog
applications,
and/or
applications requiring limited digital capabilities. The ETS-200
was designed to be fully compatible with the ETS-300 test
system. Utilizing a common DUT interface and software command
structure, the ETS-300 and ETS-200 offer customers a scalable
migration path for multi-site, analog applications.
ETS-200T. We introduced the ETS-200T in 2003
to test specific types of semiconductors known as a Field Effect
Transistors, or FETs. The ETS-200T delivers high throughput with
up to 16 site testing capability and a custom designed software
environment to make FET program development easy and effective.
Since its introduction, the 200T has received positive early
customer acceptance for its unique ability to test these devices
in highly parallel applications.
ETS-200T-FT. A new product offering for 2007,
the ETS-200T-FT provides capability for testing packaged power
FET and IGBT devices at final test. This product is designed for
use with rotary and other sequential device handlers, where a
full suite of tests is performed incrementally as devices are
contacted multiple times throughout the handling process. The
product leverages existing ETS-200T technology, and also
requires some additional specialized hardware and software to
provide a robust product offering. This new product allows us to
address the discrete final test market, which represents a new
business opportunity.
New Instrumentation. A number of new test
instruments (known as resources) were introduced in the last
12 months that expand and enhance the capabilities of our
existing test platforms and broaden the markets we serve. The
new resources introduced are:
| | HPU-100 (100 Amp High Power Unit), a third generation SmartPin resource that includes our patented pattern-based range changing technology. This resource provides the ability to rapidly force and measure a sequence of voltages and currents to facilitate high-speed production testing. The HPU-100 is unique in that it can deliver current pulses up to 100 Amps that are needed to effectively address discrete and automotive device testing. | |
| | QHSU (Quad High-Speed Signal Unit), a four channel signal analyzer that can simultaneously generate and measure four high-speed analog waveforms. This resource is valuable for testing various video frequency devices such as amplifiers and filters. It offers an on-board digital signal processor (DSP) with a robust math library for performing complex high-speed calculations. The QHSU expands the number of applications that we can address with the ETS-364/600 test platform. |
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| | QPLU (Quad Precision Linearity Unit), a highly specialized resource designed for testing precision analog to digital converters (ADCs) and precision digital to analog converters (DACs). This new resource allows us to address the challenges associated with testing precision converters. | |
| | We also developed a new Rapid Dither algorithm (patent pending) for rapid calculation of measurement errors generated by testing of ADCs in a production environment, for use in conjunction with the new QPLU hardware. |
Each of these new products expands the range of devices and
markets that can be addressed by our platforms. Consistent with
our core product development strategy, these resources are
modular plug-in units capable of operating within
our existing test platforms, making it possible for existing and
future customers to immediately take advantage of their
important features with incremental capital expense.
Software
Products
ATE operating software is required to design and run test
routines, and to record and analyze the results of such test
routines. Our Eagle Vision software is a feature-rich,
user-friendly software platform, designed to help our customers
rapidly develop test programs on our platforms. For example, our
plotting tools facilitate quick and easy graphing of response
data. Our automatic code generation tools help programmers avoid
incorrect entries and our
point-and-click
status screens allow easy monitoring and adjustment of test
system settings. The production environment offers numerous data
aggregation options and supports multiple data output formats.
Our software includes user-friendly tools for generation and
analysis of test data that are enabled by simple
point-and-click
operations.
We have developed our Eagle Vision software as the uniform
operating environment for all of our various test platforms.
This approach reduces our customers overall cost of ATE
ownership by reducing the employee training and platform
set-up time
usually associated with bringing new test platforms on line.
Eagle Vision, when combined with our
Chameleontm
device interface hardware, provides our customers with a
compatible test system upgrade path, allowing our customers to
migrate devices to our new platforms without abandoning their
investment in their existing Eagle Test systems and associated
software and device interface hardware.
We offer software licenses and maintenance contracts for the
Eagle Vision software environment, the core operating software
for our test systems. Additional licenses are also available for
use with off-line programming stations as well that allow
customers to develop and optimize (de-bug) programs without
taking a test system out of production. Software updates and
enhancements are available for the first 12 months after
the purchase of a system under standard warranties. Under our
software maintenance contracts, customers continue to receive
updates for both on-line and off-line licenses.
We continue to provide additional value to our customers through
our Eagle Vision software updates. We provide two major software
enhancement releases each year. The software release process
allows us to provide customers with substantial new capabilities
each year. We concentrate on providing new tools and features
that reduce the amount of time required to develop new tests on
the test system. These changes enhance the effectiveness of both
customer employed test engineers and our own test engineers, and
decreases the time required to introduce new device test
routines and increases the number of devices that can be tested
in production.
Technology
SmartPintm. Our
patented
SmartPintm
technology enables our products to generate and measure both
current and voltage signals at each device pin. Furthermore, our
SmartPintm
technology enables digital signal processing to be performed
locally at each pin, which eliminates the need to move test data
through a common signal bus for processing, thereby decreasing
processing time, reducing interference and improving accuracy
and yield. In addition to these features,
SmartPintm
technology provides the capability to generate multiple signals
of various ranges, which allows our customers to execute a full
set of test routines with a single starting signal, eliminating
the time required for additional software programming commands.
In this way,
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SmartPintm
technology optimizes simultaneous, or parallel, testing across
multiple sites on the same test system. We refer to this
capability as
SimulTesttm.
Chameleontm. Our
Chameleontm
technology provides interoperability among different test
platforms by allowing test application hardware from one test
system to be used on another test system.
Chameleontm
provides hardware compatibility among our various test
platforms, as well as with test hardware from some of our
competitors test platforms.
Pattern-Based
Testingtm. Our
Pattern-Based
Testingtm
is enabled by our
SmartPintm
technology in conjunction with our Eagle Vision software. In
Pattern-Based
Testingtm,
predetermined digital and analog waveforms are presented to a
DUT in a time synchronized sequence. Pattern-Based
Testingtm
technology provides the capability to simultaneously capture and
analyze both analog and digital waveforms that are emitted from
the DUT, thus reducing device test times and permitting
increased throughput and lower cost-of-test.
Floating Resources. Our test platform
architecture provides electrical separation between disparate
test sites on the same piece of test equipment by eliminating
the need for our test instrumentation resources to access power
or move signals across a common electrical pathway. Because our
floating resources have independent ground connections,
interference normally associated with a common ground pathway is
minimized, allowing each devices results to remain
isolated from the results of other adjacent sites. This leads to
better test accuracies and fewer devices failing due to
device-to-device errors and is particularly important in analog
test environments where common grounding noise may be as large
as the signal a device manufacturer may be trying to measure or
source.
Sales and
Marketing
With the exception of the United Kingdom and Japan, we market
and sell our products exclusively through our direct sales
organization, which consists of sales professionals, application
engineers (technical sales support) and technical marketing
personnel. In the United Kingdom, we utilize a combination of
direct sales representatives and distributors while in Japan we
use direct distributors. Our account managers oversee and manage
our worldwide sales activity. As of September 30, 2007, we
had 97 people in sales, marketing and applications
engineering, including 22 direct sales representatives, who
provide account management and sales administration. Because we
focus on the development of long-term relationships with major
customers, the majority of our sales and technical sales support
personnel is located in close proximity to key customer sites.
For foreign customers, this support is typically provided
through one of our foreign subsidiaries. As of
September 30, 2007 we had 66 foreign personnel providing
sales, service and applications support to our foreign customers.
Our customers generally undertake an extensive evaluation of new
test technology prior to adopting such technology. We work with
potential customers with the goal of offering them a superior
solution for their test requirements. In typical situations, our
applications engineers are required to develop a custom test
program designed to demonstrate our equipments performance
and capability to address the customers specific needs. In
cases involving existing customers, we typically work closely
with their respective product development and production groups
to help maximize the utility of our test systems throughout
their organization and to align our product development efforts
with their anticipated test requirements.
We employ a sales model that emphasizes reducing the
customers total cost-of-test per device rather than the
acquisition cost of the individual test system. We demonstrate
how a customers test costs can be reduced by utilizing our
products in lieu of competitors test systems.
We believe that strong service and support are critical to
providing an overall lower cost-of-test solution. In addition to
our applications engineering support staff, we maintain a global
network of service personnel who seek to maximize test system
up-time. We also offer services to enable our customers to
maintain and effectively use our test systems, and to enhance
our customer relationships. Our standard product warranty
includes coverage of hardware products for one year from the
date of purchase and warrants against defects in design,
materials and workmanship. In order to minimize system down-time
in the event of a service
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requirement, we typically ship a replacement product for any
non-functional standard equipment within 24 hours of the
service request. We also offer our customers additional support
after the warranty period in the form of maintenance contracts
or extended warranties.
Customers
We target analog, mixed-signal and RF semiconductor
manufacturers and related companies that serve a broad range of
market segments. Since October 1, 2003, we have delivered
over 900 test systems to more than 70 customers. Our customers
include many of the worlds leading semiconductor
manufacturers, IDMs, fabless design companies, and assembly and
test subcontractors. Companies that use our systems include:
| Agape Packaging Mfg. Co. Ltd. | Hewlett-Packard Company | National Semiconductor Corporation | ||
|
Allegro MicroSystems, Inc.
|
Infineon Technologies AG | O2MICRO, Inc. | ||
|
AMI Semiconductor, Inc.
|
International Rectifier Corporation | ON Semiconductor Corporation | ||
|
Carsem Sdn. Bhd
|
Intersil Corporation | PDF Solutions, Inc. | ||
|
Delphi Delco Electronics Corporation
|
Jiangsu Changjiang Electronics Technology Co., Ltd. | STATS ChipPAC Ltd. | ||
|
EM Microelectronic-Marin SA
|
Linear Technology Corporation | STMicroelectronics N.V. | ||
|
Exar Corporation
|
Microchip Technology Incorporated | Texas Instruments Incorporated | ||
|
Fairchild Semiconductor International, Inc.
|
Microsemi Integrated Products | Unitive Electronics, Inc. | ||
|
Guidant Corporation
|
Myson Century Inc. | UTAC Thai Ltd. |
Our customers have historically been semiconductor device
manufacturers, but our customer base has expanded to include
assembly and test subcontractors, such as STATS ChipPAC Ltd. and
Carsem Sdn. Bhd. Semiconductor manufacturers and fabless
semiconductor companies utilize these subcontractors to provide
incremental capacity and to lower their fixed production costs.
For the fiscal years ended September 30, 2007, 2006 and
2005, sales to Texas Instruments Incorporated accounted for
30.7%, 52.9% and 44.3% of our net revenue, respectively. This
customer is the only customer who has accounted for 10% or more
of our net revenue during these periods. We expect that a small
number of customers will continue to represent a significant
portion of our net revenue for the foreseeable future. Sales to
customers in the United States accounted for approximately
35.2%, 30.6% and 46.2% of net revenue for the years ended
September 30, 2007, 2006 and 2005, respectively. Sales to
customers in Malaysia accounted for approximately 17.6%, 38.8%
and 21.4% of net revenue for the fiscal years ended
September 30, 2007, 2006 and 2005, respectively. Sales to
customers in other locations accounted for approximately 47.2%,
30.6% and 32.4% of net revenue for the fiscal years ended
September 30, 2007, 2006 and 2005, respectively.
Manufacturing
and Assembly
Our test platforms consist of standard products that we custom
configure based on each customers specific needs. A large
portion of our subassembly manufacturing is outsourced to
contract manufacturers for printed circuit board fabrication,
automated assembly and the supply of machine parts. Our major
contract manufacturers include Millennium Electronics, Inc.,
Plexus Corporation and Universal Electronics, Inc., all of which
manufacture our printed circuit board assemblies, including
surface mount and through-hole technologies, and Sentral
Assemblies & Components, which manufactures our cable
assemblies and power supplies. We contract with these
manufacturers on an individual purchase order basis and do not
have long term contracts with them. We believe this selected
outsourcing strategy provides us with the flexibility to respond
more rapidly to changes in industry conditions or demand for our
test systems. We perform mechanical assembly, subassembly
testing operations and final systems integration at our Illinois
manufacturing facility in order to ensure quality. We focus on
quality assurance by monitoring the various stages of the
manufacturing process to identify areas for improvement and
manage potential manufacturing issues.
Although our products consist mainly of standard components and
prefabricated parts manufactured to our specifications, some
components and subassemblies are purchased from a limited number
of suppliers or sole source suppliers. Our major suppliers
include Arrow Electronics, Inc. and Future Electronics, both of
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which provide us with electronic components and integrated
circuits, as well as Pickering Electronics Limited, which
provides us with relays, switches and integrated circuits, and
Marcel Electronics International, which provides us with printed
circuit boards. We work closely with our suppliers to plan our
inventory procurement in quantities that will minimize our
inventory risks; however, we cannot be certain that shortages
will not develop in the future. We purchase components and
subassemblies through separate purchase orders and do not
currently have long-term purchase contracts with our suppliers.
We believe our ability to procure components and subassemblies
is a key determinant of our ability to provide our customers
with quality products on a timely basis and we continue to
evaluate alternative sources for the supply of our inventory.
Research
and Development
Our continued commitment to research and development and the
timely introduction of new products, features and upgrades are
integral to maintaining our competitive position. Our research
and development efforts seek to address new opportunities and
demands within our customer base. Our efforts are focused on the
design of test systems that lower the overall cost-of-test for
semiconductor companies. We concentrate on advancements in
electrical performance, software tools, parallel test efficiency
and test system resource density. We also focus on the design of
modular hardware for rapid implementation of new features and a
uniform software platform for operating compatibility across our
entire line of test systems. This strategy reduces our overall
product development cycles and development costs and maximizes
our research and development resources. Our research and
development activities are directed by individuals with
significant expertise and industry experience. As of
September 30, 2007, we had 67 employees dedicated to
research and development.
Our research and development organization is segmented into
specific product development groups, including mixed-signal,
high performance data converters and automotive products,
discrete components and RF products, which provides highly
dedicated focus for the investigation of new technical
opportunities in our target markets, and the development of
solutions specifically targeted at those opportunities.
We leverage our engineering efforts by utilizing standard
components whenever possible. We generally avoid the use of
customized components, such as Application-Specific Integrated
Circuits, or ASICs, when implementing functionality because it
is easier to adapt standard semiconductor designs to changing
requirements. This also eliminates high engineering risks and
costs associated with ASIC design. We use standard PCs with
Microsoft Windows as the main control computer of our test
systems. The strategy of using industry standard products has
proven successful, allowing us to leverage the significant
investments made by the largest companies in the technology
field, with minimal cost to us.
Our historical research and development expenditures for the
fiscal years ended September 30, 2007, 2006 and 2005 were
$9.1 million, $8.9 million and $7.9 million,
respectively, representing 10.6%, 7.2% and 12.4% of net revenue
in each of the respective fiscal years.
Competition
We face substantial competition in the ATE market throughout the
world. Our principal competitors include Credence Systems
Corporation, LTX Corporation and Teradyne, Inc., all of which
are major manufacturers of ATE for the analog, mixed-signal and
RF markets, in addition to other markets in which we do not
compete. Some of our competitors products that test
analog, mixed-signal and RF semiconductors have higher digital
pin counts than our products, and accordingly may be considered
to have a greater functional testing range and the ability to
test types of devices that our products do not test.
Accordingly, a customer that manufactures high-end digital
semiconductors, for example, as well as analog, mixed-signal or
RF devices, may be more inclined to purchase a test system from
one of our competitors. We believe, based on the published
report of an independent industry research organization, that
our competitors named above each have a larger share of our
addressable market than we do. Additionally, some of our
competitors, including those named above, have greater brand
recognition and greater financial, engineering, manufacturing
and marketing resources than we do. As a result, our competitors
may be able to respond more quickly to new or emerging
technologies or market developments by devoting greater
resources to the development, promotion
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and sale of products. Some of our competitors also have broader
product offerings, larger installed customer bases and more
extensive customer support capabilities than we do. We expect
our competitors to continue to improve the performance of and
support for their current products and to introduce new
products, technologies or services that could adversely affect
sales of our current and future products. In addition, other
test companies that do not currently focus on our target markets
could choose to do so.
We believe the primary competitive factors in the analog,
mixed-signal, discrete and RF ATE markets are the overall
cost-of-test, test accuracy, throughput, yield and support
infrastructure. We believe we compete favorably with respect to
each of these factors in the markets that we address. Based on
our experience in marketing our products in competition against
those of our competitors, we believe we are a very strong
competitor within the analog, mixed-signal markets and discrete,
and also an effective competitor in the RF market. However, in
contrast to a number of our competitors, we do not compete for
opportunities to test primarily digital semiconductors, such as
memory devices or microprocessors, where more costly test
systems with different capabilities are required to compete
effectively.
Intellectual
Property
Our success depends in large part on our proprietary technology.
We rely on a combination of patents, copyrights, trademarks,
service marks, trade secrets, confidentiality provisions and
licensing arrangements to establish and protect our proprietary
rights. We own two U.S. patents. These patents will expire
in approximately 15 years. While these patents are
important and relate to some of our distinct technology, we have
relied primarily on our trade secrets and copyright protection
as well as confidentiality provisions to protect our
intellectual property.
There are always risks that third parties may claim that we are
infringing upon their intellectual property rights and we could
be prevented from selling our products or services, or suffer
significant litigation or licensing expenses as a result of
these claims. In addition, third parties may infringe or design
around our intellectual property rights, and we may expend
significant resources enforcing our rights or suffer competitive
injury with adverse effects on our results of operations. Our
efforts to protect our intellectual property rights may be less
effective in some foreign countries where intellectual property
rights are not as well protected as in the U.S. For
additional, important information, review the information set
forth in Risk Factors Risks Related to
Intellectual Property.
Employees
As of September 30, 2007, we had 351 full time employees.
Of our total employees, 67 were dedicated to research and
development and 97 were dedicated to sales, marketing and
applications. None of our employees located in the United States
is represented by a union. Our employees in Europe are
represented by workers councils. We believe our
relationships with our employees are good.
Backlog
Our backlog, calculated on the basis of unfilled purchase orders
with a firm delivery date for all products and services, was
$24.3 million at September 30, 2007, compared with
$13.2 million at September 30, 2006. Since customers
may cancel or delay their orders with little regard for
potential penalties, and since new order volume may decrease
very rapidly, our backlog at any particular date is not
necessarily indicative of our future backlog or actual sales
that may be generated for any succeeding period. In the past,
our test systems have generally shipped within six to eight
weeks from the time we receive a customers purchase order,
and we expect at least 85% of our backlog as of
September 30, 2007 to ship prior to the end of December
2007. Any change in our manufacturing capacity and the time it
takes to ship our products will affect our level of backlog.
Historically, our backlog levels have also fluctuated based on
our customers ordering patterns and their inability to
predict order trends in the semiconductor industry with any
certainty.
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| Item 1A. | Risk Factors |
Set forth below are certain risk factors that could harm our
business, results of operations and financial condition. You
should carefully read the following risk factors, together with
the financial statements, related notes and other information
contained in this Annual Report on
Form 10-K.
This Annual Report on
Form 10-K
contains forward-looking statements that contain risks and
uncertainties. Please refer to the discussion of
Forward-Looking Statements on page one of this
Annual Report on
Form 10-K
in connection with your consideration of the risk factors and
other important factors that may affect future results described
below.
Risks
Related to Our Business and Industry
The
highly cyclical nature of the semiconductor industry could
adversely affect our operating results.
Our business and operating results depend to a significant
extent on capital expenditures by companies in the semiconductor
industry that purchase our ATE. Historically, the semiconductor
industry has been highly cyclical with recurring periods of
over-supply. These cycles typically have a disproportionately
negative impact on capital equipment manufacturers, including
providers of test systems like Eagle Test. In most cases, the
decrease in capital expenditures for test systems by our
customers is more pronounced than the downturn in the overall
semiconductor industry.
We believe that semiconductor industry downturns will likely
recur, and because they often occur very rapidly, we cannot
adequately foresee their timing and extent, or their effect on
customer orders and revenues. If we do not accurately predict
the timing or extent of a downturn, we may not adequately reduce
our operating expenses in light of decreased revenue, which will
adversely affect our financial performance, and potentially our
stock price. During downturns we experienced, and in the future
we may experience:
| | decreased customer orders, test systems shipments and revenue; | |
| | decreases in backlog; | |
| | decreases in the average selling prices, or ASPs, of our test systems; | |
| | delays in order commitments; | |
| | lower operating margins; | |
| | increases in order cancellations and customer-requested shipment delays; | |
| | excess production capacity; | |
| | delays in collecting accounts receivable; and | |
| | excessive inventory levels. |
As a result of these and other factors, industry downturns are
expected to negatively impact our business and financial
performance. Moreover, such downturns, or the speculation about
such downturns by investors or industry analysts, may have a
material adverse effect on our stock price.
Our
quarterly operating results may fluctuate significantly from
period to period and this may cause our stock price to
decline.
In the past we have experienced, and in the future we expect to
experience, fluctuations in revenues and results of operations
from quarter to quarter. These fluctuations can be caused by a
variety of factors including:
| | rapid shifts in demand for, or acceptance of, our products as a result of the cyclical nature of the semiconductor equipment industry or otherwise, often resulting in sharp reductions in equipment sales during industry downturns and increased equipment sales during periods of industry recovery; | |
| | the loss of a significant customer or reduced capital spending by a customer; | |
| | delays, cancellations or reschedulings, or other changes in the timing or terms of product shipments; |
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| | acceleration or postponement of existing customer order delivery dates; | |
| | delays in acceptance of products as a result of our failure to meet customers specifications; | |
| | the timing of our new product introductions, and market acceptance of our new products and enhanced versions of our existing products; | |
| | our competitors announcements of new products, services or technological innovations, which can, among other things, render our products less competitive; | |
| | competitive pressures resulting in lower ASPs for our test systems; | |
| | lower gross margins in any period due to changes in our product mix or increased prices for components; | |
| | our inability to quickly reduce our fixed costs or managements decision to maintain headcount notwithstanding decreased demand for our products; | |
| | disruptions in our manufacturing or in our supply of components, causing us to delay shipment of our products; and | |
| | write-offs of excess or obsolete inventory and accounts receivable that are not collectible. |
A significant portion of our revenue is derived from the sale of
a relatively small number of test systems. Accordingly, a
decline in the number, or change in the timing or terms, of the
test systems we sell from quarter-to-quarter may also cause
significant changes in our results of operations. This, in turn,
would likely cause a decline in the market price of our common
stock.
We believe that quarter-to-quarter comparisons of our revenue
and operating results are not necessarily meaningful or an
accurate indicator of our future performance. Because of this
difficulty in predicting future performance, our results of
operations may fall below the expectations of securities
analysts or investors in future quarters. Our failure to meet
these expectations would likely cause a decline in the market
price of our common stock.
We
depend on a small number of customers for a significant portion
of our sales, and the loss of any of these customers will
adversely affect our revenue.
A small number of customers has accounted for a significant
portion of our revenue in any particular period. We expect that
we will continue to depend on a small number of customers to
account for a significant percentage of our revenue for the
foreseeable future. Our customers, including our most
significant customers, are not obligated by long-term contracts
to purchase our test systems, and may cancel orders with little
regard for potential penalties. If any of our large customers
reduces or cancels its purchases from us for any reason, it
could have an adverse effect on our revenue and results of
operations. For additional information, see the section entitled
Business Customers in Part I,
Item 1. in this Annual Report on
Form 10-K.
We
face difficulty in obtaining new customers because of the high
cost of switching test equipment vendors in our
markets.
Semiconductor companies typically select one vendors
systems for testing an entire product family of semiconductors,
and make substantial investments to obtain test systems and
ancillary equipment, and to develop related test program
software. Once a semiconductor company has implemented a test
system for a product family of semiconductors, it is often
difficult and costly to switch to another vendors test
system because the test system is often part of the product
specifications for a newly developed device. Accordingly, unless
our test systems offer substantial performance or cost
advantages that materially outweigh a customers expense of
switching to our test systems, it will be difficult for us to
achieve significant sales to that customer once it has selected
another vendors test system for an application.
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Our
sales cycle is long, requires significant investment, and may
not result in additional sales.
Our customers generally take considerable time to evaluate our
test systems, and many people are involved in the evaluation and
decision-making process. Our product sales cycle typically
ranges from six to nine months. Sometimes our sales cycle can be
much longer, particularly when the sales process involves
developing new test progr