Opnext, Inc - Recent Material Event
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EX-10.4.D:
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FORM OF AMENDMENT TO STOCK APPRECIATION RIGHT AGREEMENT
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EX-23.1:
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CONSENT OF ERNST & YOUNG LLP
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EX-31.1:
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CERTIFICATION
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EX-31.2:
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CERTIFICATION
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EX-32.1:
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CERTIFICATION
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EX-32.2:
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CERTIFICATION
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2
PART I
Business
Description
We are a leading designer and manufacturer of optical modules
and components which enable high-speed telecommunications and
data communications networks globally. Our transceiver modules,
which typically utilize our lasers and detectors, convert
signals between electrical and optical for transmitting and
receiving data over fiber optic networks, a critical function in
optical communications equipment. In particular, we are a leader
in both the telecommunications and data communications
applications for the fast growing market for 10Gbps and 40Gbps
transceiver modules and optical components. Our expertise in
core semiconductor laser and other optical communications
technologies has helped us create a broad portfolio of products
that address customer demands for higher speeds, wider
temperature ranges, smaller sizes, lower power consumption and
greater reliability than other products currently available in
the market. We view ourselves as a strategic vendor to our
customers and we have well-established relationships with many
of the leading telecommunications and data communications
network systems vendors such as Alcatel-Lucent, Cisco Systems,
Inc. and subsidiaries (Cisco) and Hitachi, Ltd.
(Hitachi).
Telecommunications and data communications networks are becoming
increasingly congested due to the growing demand from consumers,
enterprises and institutions for high bandwidth applications.
This bandwidth constraint has caused network service providers
to turn to their equipment vendors to provide solutions that
maximize bandwidth and reliability while minimizing cost.
Increasing the communications data rate in networks is an
important element of easing network congestion, and, as a
result, network service providers are deploying 10Gbps and
40Gbps equipment more broadly throughout their networks. We have
a broad portfolio of industry-defined product types, including
tunable and fixed wavelength 300 pin, XENPAK, X2, XPAK, XFP,
SFP+, XMD and SFP modules, which can be adjusted to operate at
specific wavelengths enabling higher bandwidth on each optical
fiber. We focus on the 10Gbps, 40Gbps and above markets which we
believe are some of the fastest growing and most important in
the communications industry.
We were founded in September 2000 as a subsidiary of Hitachi and
subsequently spun-out of its fiber optic components business. We
draw upon a
30-year
history of fundamental laser research, manufacturing excellence,
and product development that has helped create several
technological innovations such as the creation of 10Gbps and
40Gbps laser technologies. We work closely with Hitachis
renowned research laboratories under long-term contractual
relationships to conduct research and commercialize products
based on fundamental laser and photodetector technology. We view
our relationship with Hitachi as a competitive advantage because
this relationship helps us remain a leader in fundamental
semiconductor laser research for the communications market.
These research efforts have enabled us to develop market
leadership in the 10Gbps and 40Gbps transceiver module market
and place us in a strong position to develop differentiated
products for emerging higher-speed markets, such as the 40GbE
and 100Gbps markets.
Since our founding in 2000, we have expanded our customer base,
increased our design wins and made significant operational
improvements. In addition, we have expanded our product lines
and our patent portfolio, which, as of May 31, 2008,
included 449 awarded patents and 328 pending patent
applications, as well as acquired and integrated two businesses.
Through our direct sales force supported by manufacturer
representatives and distributors, we sell products to many of
the leading network systems vendors throughout the Americas,
Europe, Japan and Asia Pacific. Our customers include many of
the top telecommunications and data communications network
systems vendors in the world. We also supply components to
several major transceiver module companies and sell into select
industrial and commercial applications where we can apply our
core laser capabilities, such as medical systems, laser printers
and barcode scanners. In February 2007, we completed our initial
public offering from which we received net proceeds of
approximately $170.9 million.
Industry
Background
Over the past several years, telecommunications networks have
undergone significant changes as network service providers
pursue more profitable service offerings and lower operating
costs. Network service providers continue to add high speed
network access such as Wi-Fi, WiMAX, 3G, DSL, cable and FTTx,
and are converging
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traditionally separate networks for delivering voice, video and
data into
IP-based
integrated networks. Concurrent with these trends, a growing
demand for high bandwidth applications such as
e-mail,
music and video downloads and streaming, on-line gaming,
peer-to-peer file sharing and IPTV is challenging network
service providers to supply increasing bandwidth to their
customers. These applications drive increased network
utilization across the core and at the edge of wireline,
wireless and cable networks, which we collectively refer to as
telecommunications networks. Additionally, in data
communications, enterprises and institutions are managing the
rapidly escalating demands for data and bandwidth and are
upgrading and deploying their own high speed local, storage and
wide area networks, also called LANs, SANs and WANs,
respectively. These deployments increase the ability to utilize
high bandwidth applications that are growing in importance to
their organizations and also increase utilization across
telecommunications networks as this traffic leaves the LANs,
SANs and WANs and travels over the network service
providers edge and core networks.
Both telecommunications and data communications networks are
utilizing optical networking technologies capable of supporting
higher speeds, additional features and greater interoperability
to accommodate higher bandwidth requirements and achieve the
lowest cost. Today, both telecommunications network systems
vendors such as Alcatel-Lucent and data communications network
systems vendors such as Cisco are producing optical systems
increasingly based on 10Gbps and 40Gbps speeds, including
multi-service switches, DWDM transport terminals, access
multiplexers, routers, Ethernet switches and other network
systems. Mirroring the convergence of telecommunications and
data communications networks, these network systems vendors are
increasingly addressing both telecommunications and data
communications applications. Faced with technological and cost
challenges, they are focusing on their core competencies of
software and systems integration, and are relying upon
established module and component suppliers for the design,
development and supply of critical hardware components such as
products that perform the optical transmit and receive functions.
To address the increased network speed requirements, optical
module and component companies need to provide products that
incorporate improved semiconductor laser technology that
addresses power consumption, operating temperature and size, all
of which are inter-related primary challenges, while also
meeting customers stringent demands for product
reliability:
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The Power Challenge. Modules that operate at
10Gbps consume two to more than five times as much electrical
power as those modules operating at the preceding data rate and
the power challenges are expected to become more difficult as
the industry moves beyond 10Gbps. Network service providers
generally have fixed, limited space in their network central
offices, closets, and data centers to house network equipment,
creating de facto standards on the physical size allowed for
each piece of network equipment regardless of data rate. To
offer increasingly higher speed systems, network system vendors
need more efficient modules to support greater port density
while adhering to power supply and cooling system constraints.
These constraints drive the need for laser technology with
higher temperature tolerance and improved efficiency which
reduces power consumption and enables smaller form factor
modules to be used.
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The Temperature Challenge. Within an optical
module, the laser diode is the component most sensitive to
temperature. As a result, 10Gbps modules have in the past been
constrained to 70°C maximum operating case temperature.
Even in temperature controlled environments, heat dissipation
from neighboring electronic components can raise internal
equipment temperatures to levels that degrade laser and module
performance. Furthermore, some network equipment is located
outdoors in non-temperature controlled environments where
transceiver modules need to operate reliably up to an operating
case temperature of +85° C. Therefore, customers are
demanding optical modules that can operate at wider temperature
ranges, especially incorporating uncooled lasers that do not
require costly and inefficient thermoelectric coolers.
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The Size Challenge. The system throughput,
data rate of each port and the overall chassis dimensions of a
system define the bandwidth capacity of that system. Network
service providers and enterprises have limited space in which to
house their optical network equipment within an office or
equipment room. Expanding the capacity of a system requires
increasing the number of ports and the data rate of those ports.
To meet these higher speed and density requirements, industry
leaders have defined smaller 10Gbps transceiver packages. As the
size of these packages decreases, so does their ability to
dissipate heat making it virtually impossible to support cooled
laser technology. Therefore, lower power consumption uncooled
laser technology with
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higher temperature tolerance and improved efficiency is required
to meet the thermal capacity of these smaller packages.
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The increasing complexity of the components, industry
consolidation and the need to increase the pace of innovation
while reducing costs have led the network systems vendors to
reduce their number of module and component suppliers and favor
vendors with more comprehensive product portfolios and deeper
product expertise. Suppliers who can successfully meet these
challenges may become involved early in network systems
vendors product development and become a strategic part of
their product planning process. Advantages of being one of these
select suppliers can include faster time to market and cost
advantages.
Our Key
Advantages
We are a leading designer and manufacturer of transmit and
receive optical modules and components which enable high-speed
telecommunications and data communications networks globally. We
believe we offer the most comprehensive 10Gbps transceiver
product portfolio in the communications industry. We believe we
are a leader in the 40Gbps client and line side module market
and a leader in the development of 40GbE and 100Gbps
technologies. Our modules and components are utilized by leading
telecommunications and data communications network systems
vendors such as Cisco and Alcatel-Lucent. We have positioned
ourselves as a strategic vendor for our customers by engaging
them early in their planning cycle to help guide product
development, addressing the key market requirements and
maintaining market leadership in core semiconductor laser-based
technology. We believe customers choose to work with us for
several reasons, including:
Technology Leadership. Our products are built
on a foundation of optical technologies based on more than
30 years of research and development experience, resulting
in 449 patents awarded and 328 patent applications pending
worldwide as of May 31, 2008. Our technological innovation
extends to core semiconductor laser design and materials
systems, optical and electronic component integration, high
precision wavelength stability for DWDM and tunable
applications, and high speed transmission design for
10Gbps, 40Gbps and higher speeds. The semiconductor laser
is at the core of all optical systems and is one of the most
complex aspects of optical communications with a long
development cycle. We are one of only a limited number of global
providers of high performance 10Gbps and 40Gbps lasers. We
conduct our research both independently and through long-term
contractual relationships with Hitachi. We are committed to
conducting fundamental semiconductor laser research as a source
of differentiation. By maintaining leadership in semiconductor
laser technology, we are able to better maximize the performance
of our transceiver modules as well as gain cost and operational
efficiencies through selective vertical integration.
Broad Product Line. We have one of the most
comprehensive transmit and receive optical module portfolios for
both telecommunications and data communications applications,
particularly for 10Gbps and 40Gbps transceiver modules. Our
products support a wide range of data rates, protocols,
wavelengths, transmission distances and industry standard
platforms. Our portfolio consists of 10Gbps and 40Gbps
transceiver modules, including tunable transceivers, a broad
line of 2.5Gbps and lower speed SFP transceiver modules, and new
or planned products for emerging product platforms such as SFP+,
40GbE, 100Gbps, XLMD and XMD. We believe the breadth of our
product portfolio positions us favorably with leading network
systems vendors seeking to reduce their number of suppliers in
favor of partnering with suppliers with greater product
capabilities and expertise.
Superior Performance. Our performance
advantage is, in most cases, due to our use of our industry
leading lasers, superior integration and module design
capabilities. Our core semiconductor laser technology allows us
to efficiently design products that exceed the current power,
size, temperature and reliability requirements of our customers,
thus providing them with additional system level reliability and
design flexibility. For example, one of our recent products is
an indium phosphide and aluminum based 10Gbps uncooled DFB laser
that enables 10Gbps optical transceivers to have an operating
case temperature of 85° C and provides network system
vendors additional heat tolerance margin. This technology
delivers reduced power consumption that enables high port
density and smaller packages such as SFP+. Additionally, this
technology is allowing us to develop new 10Gbps modules to be
used in outdoor non-temperature controlled environments and
enable higher capacity in our customers next generation
systems. In addition to our superior
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technological performance, we have established long-term
relationships with customers by working closely with them to
better understand the individual requirements of their products
and by providing superior customer service and technical support.
Continuous Innovation. We continuously
innovate in laser and optical technologies such as uncooled DFB
lasers, cooled and uncooled EA-DFBs, and new developments in
tunable lasers. As a result, our customers often involve us
early in the planning process for their next generation of
products or engage us to create custom solutions for complex
problems. Our early involvement in the design cycles of our
customers products deepens our understanding of their
long-term needs, increases our strategic importance to these
customers and enhances our ability to cost effectively introduce
new products that best address their needs. We were also the
first to market or have been a leading market innovator in
products such as 10Gbps lasers, 10Gbps 300 pin transceivers, a
DWDM version of XENPAK and X2 transceivers, a 40Gbps laser and
300-pin transceiver, an APD that meets the more stringent long
distance telecom specification and an uncooled XFP module
operating at 85° C.
MSA Leadership. We actively participate with
network systems vendors and module and component vendors in the
establishment of multi-source agreements, also known as MSAs,
which define new product generations. Many customers use these
MSAs as a framework for the design of their new systems. These
MSAs specify the mechanical dimensions, electrical interface,
diagnostic and management features and other key specifications
such as heat and electrical interference that enable network
systems vendors to plan their new systems accordingly. We are
able to substantially influence the MSAs due to our sustained
leadership position in the industry and understanding of key
customer needs, an understanding developed via our close
relationships at the research and development planning level and
our extensive technical support resources. We were founders or
early members of successful 10Gbps MSAs such as 300 pin, XENPAK,
X2 SFP+, XLMD and XMD. Moving forward we expect to establish new
MSAs for 40GbE and 100Gbps modules. We believe our
involvement in MSA committees, in which our customers also
participate, contributes to customer confidence that our new
products will meet their performance, quality and manufacturing
expectations.
Technology
and Research and Development
We utilize our proprietary technology at many levels within our
product development, ranging from the basic materials research
that created the innovative materials we use in our lasers to
the sophisticated component integration and optimization
techniques we use to design our modules. We are committed to
conducting fundamental research in laser technologies. In
addition, we have a proven record of successfully productizing
this research. Our technology is protected by our strong patent
portfolio and trade secrets developed in deployments with our
extensive customer base. Our leading technologies start with our
fundamental laser technology and extend through design and
assembly. In particular, the following technologies are central
to our business:
Semiconductor Laser Design &
Manufacturing. We are a leading manufacturer and
designer of lasers for high speed fiber optic communications
such as 10Gbps and 40Gbps. In the development and manufacturing
of new lasers, we utilize accumulated knowledge in areas such as
semiconductor growth, semiconductor materials systems, quantum
well engineering, design for very precise wavelengths, and high
frequency performance. This knowledge enables performance
improvements such as miniaturization, wavelength control, wide
temperature, and high speed operation, and provides us with a
time and knowledge advantage over companies that source their
10Gbps and 40Gbps lasers from other companies.
Optical Semiconductor Materials. Central to
our laser design and manufacturing is our experience and
research in materials, one of the most challenging aspects of
optical communications technology and a source of competitive
advantage. Our advances in optical semiconductor materials have
enabled us to develop new lasers that are more compact, offer
greater control of the light emitted and utilize less power to
operate. For example, our innovations in the use of aluminum in
semiconductor lasers are utilized in several of our new lasers
including our uncooled DFB laser and an EA-DFB laser which
integrates a modulator with the DFB laser on the same chip. The
use of aluminum gives these lasers increased temperature
tolerance, improved efficiency, faster response time and greater
wavelength stability, all while achieving or exceeding industry
reliability requirements. Our research continues on new
materials systems for use in developing new laser
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structures that provide further improvements in laser operating
temperature and efficiency. We also have developed novel
techniques for the use of the materials system InAlAs in the
construction of high performance avalanche photodiodes which is
central to performing the receive function.
Subassembly Design. Laser diodes and
photodetectors are particularly sensitive to external forces,
fields and chemical environments, so they are typically housed
in a hermetically sealed package. These laser diodes and
photodetectors are placed upon special ceramic circuit boards
and are packaged into a mechanical housing with certain
electronics into transmit or receive optical subassemblies, or
TOSA and ROSA, respectively. We have experts dedicated to TOSA
and ROSA design with fundamental knowledge in laser physics,
high frequency design and mechanical design who have garnered
numerous patents. We are a founding member of the XMD and XLMD
MSAs which create a platform of miniature, high
performance TOSAs and ROSAs for 10Gbps and 40Gbps that can be
used across multiple products and sold to external customers.
Module Design. Transceiver modules integrate
the TOSA, ROSA, integrated circuits and other components into
compact packages specified by various MSAs. We possess key
technology in the form of high speed circuit design skills for
error-free processing, transmitting, receiving and outputting of
information, exceptional mechanical design to allow for higher
tolerance of electrical and mechanical shock, and excellent
thermal design to transfer heat away from key components and out
of the module. We also have expertise in the design and
manufacture of optical modules for long distance transmission
including tunable laser modules. Long-distance transmission
modules require special manipulation of the optical signal to
insure that error free transmission is achieved over tens to
hundreds of kilometers of optical fiber.
Our research and development plans are driven by customer input
obtained by our sales and marketing teams and in our
participation in various MSAs, and by our long-term technology
and product strategies. We review research and development
priorities on a regular basis and advise key customers of our
progress to achieve better alignment in our product and
technology planning. For new components and more complex
modules, research and development is conducted in close
collaboration with our manufacturing operations to shorten the
time to market and optimize the manufacturing process. We
generally perform product commercialization activities ourselves
and utilize our Hitachi relationship to jointly develop or fund
more fundamental optical technology such as new laser designs
and materials systems.
Products
We design, manufacture and market optical modules and components
that transmit and receive data. Our products are used in both
telecommunications and data communications markets, and we have
one of the most comprehensive transceiver product portfolios for
these markets, particularly at 10Gbps and 40Gbps data rates. Our
product portfolio includes a broad range of solutions that vary
by level of integration, communications protocol, form factor
and performance level. Our portfolio primarily consists of
10Gbps and 40Gbps transceiver modules, including tunable
transceivers, a broad line of 2.5Gbps and lower speed SFP
transceiver modules, and new or planned products for emerging
product platforms such as SFP+, 40GbE, 100Gbps, XLMD and XMD. We
sell transmit and receive optical modules and components, which
are optical components that either generate or receive light
signals, and our products are distinguished by their reliability
and superior performance across several technical parameters.
The primary components that comprise all of our products are
laser diodes and photodetectors. The laser diode provides the
light source for communication over fiber optic cables. Our
current communications laser diode product offering includes DFB
lasers and EA-DFB lasers at selected 2.5Gbps, 10Gbps and 40Gbps
data rates and 1310nm and 1550nm wavelengths. We expect our
future developments to include tunable lasers, 25Gbps EA-DFB
lasers for use in 100Gbps (4 x 25Gbps) applications, and 40GbE
laser source(s). Photodetectors receive the optical signal; we
offer high performance avalanche photodiodes, or APDs, that
operate at the same data rates and wavelengths as our lasers. We
believe our laser diodes and photodetectors offer superior
performance in key metrics such as reliability, temperature
range, power consumption, stability and sensitivity.
The next level of integration involves packaging the laser
diodes or photodetectors with integrated circuits and other
electronic components that perform various control and signal
conversion functions. A transmitter combines a
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laser diode with electronic components that control the laser
and convert electrical signals from the network systems
equipment into optical signals for transmission over optical
fiber. A receiver combines a photodetector with electronic
components that performs the opposite function, namely,
converting the optical signal back into electrical form for
processing by the network systems equipment. A transceiver
combines both transmit and receive functions in a single module.
Our modules support a wide range of protocol interfaces for
telecommunications and data communications systems such as
Ethernet, Fibre Channel, and SONET/SDH ranging in speeds from
155Mbps to 40Gbps as well as utilizing DWDM and tunable
technology. Depending on the system type, telecommunications
systems may have two to sixteen transceiver modules typically
mounted onto line cards while data communications systems may
have from two to forty-eight ports. Optical network systems
vendors now rely upon transceiver modules to perform transmit
and receive functions in most of their new system designs.
Our products include:
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Product Line
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Product Types
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Equipment
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Application
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Speed
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Reach
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Shipping
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300 pin
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Transport & Routers
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Telecom & Datacom
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40/43Gbps
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2km, Tunable PSBT
and DPSK
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Since 2004
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300 pin
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Transport, MSS, Routers & AM*
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Telecom & Datacom
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10Gbps
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600m, 2km, 12km, 20km, 40km, 80km,
DWDM & Tunable
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Since 2000
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XENPAK
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Switches & Routers
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Datacom
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10Gbps
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300m, 10km, 40km, 80km & DWDM
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Since 2002
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X2
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Switches & Routers
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Datacom
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10Gbps
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300m, 10km, 40km, 80km & DWDM
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Since 2004
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XPAK
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Servers, Switches
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Datacom & Storage
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10Gbps
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300m, 10km
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Since 2005
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XFP
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Transport, MSS, Switches, Routers & AM, Servers
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Telecom, Datacom & Storage
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10Gbps
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300m, 600m, 2km, 12km, 20km, 40km, 80km & DWDM
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Since 2004
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SFP+
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Servers, Switches
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Datacom & Storage
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8-10Gbps
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100m, 300m, 10km & 40km
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Since 2007
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XMD and XLMD
TOSA & ROSA
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Transceiver Modules
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Telecom & Datacom
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10-43Gbps
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10km, 40km, 80km
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Since 2005
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LDM/PDM
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Transport & MSS
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Telecom
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10Gbps
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40km, 80km, DWDM
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Since 2000
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SFP
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Transport, MSS, Routers & AM
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Telecom
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155Mbps, 622Mbps, 2.5Gbps
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2km, 15km, 40km, 80km, DWDM
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Since 2003
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SFP
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Hubs & Switches
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Datacom
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1.25Gbps
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500m, 10km, 80km
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Since 2004
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MSS refers to multi-service switches and AM refers to access
multiplexers. |
For the industrial and commercial markets, we offer lasers and
infrared LEDs for a variety of specialized applications. Our
products include visible lasers around the 635nm, 650nm and
670nm wavelengths for applications such as laser printing,
industrial barcode scanning, medical imaging and professional
contractor tools; lasers around the 780nm and 830nm wavelengths
for scientific measurement, night vision, and other infrared
applications; and infrared LEDs around the 760nm, 840nm and
880nm wavelengths for sensors used in robotics and other
industrial applications.
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Customers
We have a global customer base for both the telecommunications
and data communications markets that consists of many of the
leading network systems vendors worldwide including
Alcatel-Lucent, Ciena Corporation, Cisco, ECI Telecom LTD,
Extreme Networks, Inc., Fujitsu Limited, Hitachi, Huawei
Technologies Co., Ltd, Juniper Networks, Inc., Mitsubishi
Electric Corp., Neterion, Inc. and Sumitomo Electric Industries,
Ltd. The number of leading network systems vendors that supply
the global telecommunications and data communications market is
concentrated, and so, in turn, is our customer base.
Additionally, Cisco and Alcatel-Lucent have consistently been
our two largest customers. Cisco, our largest data
communications customer, represented 40.0%, 37.7% and 27.9% of
our total revenues in the fiscal years ended March 31,
2008, 2007 and 2006, respectively. Alcatel-Lucent is our largest
telecommunications customer, representing 20.0% of our total
revenue for the fiscal years ended March 31, 2008 and 2007
while Alcatel represented 12.7% our total revenues for the
fiscal year ended March 31, 2006. Hitachi accounted for
3.2%, 4.3% and 15.0% of our total revenues for the fiscal years
ended March 31, 2008, 2007 and 2006, respectively. Other
than Cisco, Hitachi, Alcatel-Lucent and Alcatel, no other
customer accounted for more than ten percent of sales in the
fiscal years ended March 31, 2008, 2007 and 2006. These
customers purchase from us directly or, in certain cases,
indirectly through their specified contract manufacturers.
Our customers in the industrial and commercial markets consist
of a broad range of companies that design and manufacture
laser-based products, including medical and scientific systems,
industrial bar code scanners, professional grade construction
and surveying tools, gun sights and other security equipment,
sensors for robotics and industrial automation, and printing
engines for high-speed laser printers and plain paper copiers.
Competition
The market for optical modules and components is highly
competitive and is characterized by continuous innovation. While
no company competes against us in all of our product areas, our
competitors range from the large, international companies
offering a wide range of products to smaller companies
specializing in narrow markets. In the telecommunications and
data communications markets, we compete primarily with the
suppliers of transmit and receive optical modules and
components, at both the level of basic building blocks, such as
lasers and photodetectors, as well as at the integrated module
level such as transceivers for telecommunications and data
communications applications. Competitors include Avago, Avanex,
Bookham, Emcore, Finisar, Fujitsu, JDS Uniphase, Mitsubishi,
Optium, and Sumitomo (which markets products in North America as
Excelight). The market for optical modules and components is
highly competitive. We believe the principal competitive factors
are:
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product performance, including size, speed, operating
temperature range, power consumption and reliability;
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price to performance characteristics;
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delivery performance and lead times;
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ability to introduce new products in a timely manner that meet
customers design-in schedules and requirements;
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breadth of product solutions;
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sales, technical and post-sales service and support;
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sales channels; and
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ability to comply with new industry MSAs and requirements.
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In our industrial and commercial product lines, we principally
compete with Sanyo, Sony, Arima and QSI. We believe the
principal competitive factors are:
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price to performance characteristics;
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delivery performance and lead times;
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breadth of product solutions;
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sales, technical, and post-sales service and support; and
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sales channels.
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9
Because some of our competitors have longer operating histories
and have greater financial, technical, marketing and other
resources than we have, these companies have the ability to
devote greater resources to the development, promotion, sale and
support of their products. For example, in the
telecommunications and data communications markets, some of our
competitors offer broader product portfolios by supplying
passive components or a broader range of lower speed
transceivers. Other competitors may also have preferential
access to certain network systems vendors or offer directly
competitive products which may have certain better performance
measures than our products. In addition, our competitors that
have large market capitalizations or cash reserves may be better
positioned than we are to acquire other companies to gain new
technologies or products that may compete with our product
lines. Any of these factors could give our competitors a
strategic advantage. Therefore, although we believe we currently
compete favorably with our competitors, we cannot be assured
that we will be able to compete successfully against either
current or future competitors in the future.
Manufacturing
We fabricate key lasers and photodetectors for use in our
modules and for sale to other module suppliers in our dual
research and development and manufacturing facilities in Totsuka
and Komoro in Japan. Optical component manufacturing is highly
complex, utilizing extensive know-how in multiple disciplines
and accumulated knowledge of the fabrication equipment used to
achieve high manufacturing yields, low cost and high product
consistency and reliability. Co-location of our research and
development and manufacturing teams and utilization of
well-proven fabrication equipment helps us shorten the time to
market and achieve or exceed manufacturing cost and quantity
targets. After chip fabrication, we utilize contract
manufacturing partners for the more labor intensive step of
packaging the bare die into standardized components such as
TOSAs, ROSAs, laser diode modules and TO cans that are then
integrated into transceiver modules and other products.
For our 10Gbps transceiver modules, we use a combination of
internal manufacturing and contract manufacturing. Typically, we
begin manufacturing new 10Gbps modules in-house to optimize
manufacturing and test procedures to achieve internal yield and
quality requirements before transferring production to our
contract manufacturing partners. We develop long-term
relationships with strategic contract manufacturing partners to
reduce assembly costs and provide greater manufacturing
flexibility. The manufacture of some products such as certain
customized 10Gbps modules and 40Gbps modules may remain in-house
even in mass production to speed time to market and bypass
manufacturing transfer costs.
For our 2.5Gbps and lower speed SFP modules, we typically move
new product designs directly to contract manufacturing partners.
These lower speed modules are generally less complex than 10Gbps
modules and ramp up to much greater volumes in mass production.
Our contract manufacturing partners are located in China, Japan,
the Philippines, Taiwan, Thailand, Mexico and the United States.
Certain of our contract manufacturing partners that assemble or
produce modules are strategically located close to our
customers contract manufacturing facilities to shorten
lead times and enhance flexibility.
We follow established new product introduction processes that
ensure product reliability and manufacturability by controlling
when new products move from sampling stage to mass production.
We have stringent quality control processes in place for both
internal and contract manufacturing. We utilize comprehensive
manufacturing resource planning systems to coordinate
procurement and manufacturing with our customers
forecasts. These processes and systems help us closely
coordinate with our customers, support their purchasing needs
and product release plans, and streamline our supply chain.
Sales,
Marketing and Technical Support
In the communications market, we primarily sell our products
through our direct sales force supported by a network of
manufacturer representatives and distributors. Our sales force
works closely with our field application engineers, product
marketing and sales operations teams in an integrated approach
to address a customers current and future needs. We assign
account managers for each customer account to provide a clear
interface to our customers, with some account managers
responsible for multiple customers. The support provided by our
field application engineers is critical in the product
qualification stage. Transceiver modules, especially at 10Gbps
and
10
40Gbps and above, are complex products that are subject to
rigorous qualification procedures of both the product and the
supplier and these procedures differ from customer to customer.
Also, many customers have custom requirements in addition to
those defined by MSAs to differentiate their products and meet
design constraints. Our product marketing teams interface with
our customers product development staffs to address
customization requests, collect market intelligence to define
future product development, and represent us in MSAs.
For key customers, we hold periodic technology forums for their
product development teams to interact directly with our research
and development teams. These forums provide us insight into our
customers longer term needs while helping our customers
adjust their plans to the product advances we can deliver. Also,
our customers are increasingly utilizing contract manufacturers
while retaining design and key component qualification
activities. As this trend matures, we continually upgrade our
sales operations and manufacturing support to maximize our
efficiency and flexibility and coordination with our customers.
In the industrial and commercial market, we primarily sell
through a network of manufacturing representatives and
distributors to address the broad range of applications and
industries in which our products are used. The sales effort is
managed by an internal sales team and supported by dedicated
field application engineering and product marketing staff. We
also sell direct to certain strategic customers. Through our
customer interactions, we continually increase our knowledge of
each applications requirements and utilize this
information to improve our sales effectiveness and guide product
development.
Since inception, we have actively communicated the Opnext brand
worldwide through participation at trade shows and industry
conferences, publication of research papers, bylined articles in
trade media, advertisements in trade publications and
interactive media, interactions with industry press and
analysts, press releases and our company web site, as well as
through print and electronic sales material.
Patents
and Other Intellectual Property Rights
We rely on patent, trademark, copyright and trade secret laws
and internal controls and procedures to protect our technology
and brand.
As of May 31, 2008, we had been issued 449 patents, of
which 139 patents are from the same technology in different
jurisdictions, and have 328 patent applications pending, of
which 97 patents are from the same technology in different
jurisdictions. Patents have been issued in various countries
including the U.S., Japan, Germany and France, with the main
concentrations in the U.S. and Japan. Of the 172 patents
issued in the U.S., 20 will expire within the next five years
and, of those, nine will expire in the next two years. Of the
202 patents issued in Japan, 32 will expire in the next five
years and, of those, 22 will expire in the next two years. We do
not expect the expiration of our patents in the next two years
to materially affect our business. Our patent portfolio covers a
broad range of intellectual property including semiconductor
design and manufacturing, optical device packaging, TOSA/ROSA
and module design and manufacturing, electrical circuit design,
tunable and DWDM technology, connectors and manufacturing tools.
We follow well-established procedures for patenting intellectual
property and have internal incentive plans to encourage the
protection of new inventions.
For technologies that we develop in cooperation with Hitachi,
either on a joint development or funded project basis, we have
contractual terms that define the ownership, use rights, and
responsibility for intellectual property protection for any
inventions that arise. We also benefit from long-term
cross-licensing agreements with Hitachi that allow either party
to leverage certain of the other partys intellectual
property rights worldwide.
Opnext is a registered trademark in the U.S., Japan and the
European Union as a Community Trademark (CTM). Trademark
registration is pending in China. We have four product family
names trademarked with one pending. The licensing agreement with
Hitachi to utilize the indication Powered by Hitachi
expired February 20, 2008 and we have ceased using such
indication.
We take extensive measures to protect our intellectual property
rights and information. For example, every employee enters into
a confidential information, non-competition and invention
assignment agreement with us when they join and are reminded of
their responsibilities when they leave. We also enforce a
confidential information and invention assignment agreement with
contractors.
11
Employees
As of May 31, 2008, we had 438 full-time employees. Of
the 438 employees, 333 are located in Japan, 93 in the
U.S., eight in Europe and four in China. Of our 438 total
employees, 159 are in research and development, 146 are in
manufacturing, 80 are in sales and marketing, and 53 are in
administration. We consider our relationships with our employees
to be good. In addition, none of our employees is represented by
a labor union.
Risks
Relating To Our Business and Industry
We
depend on a limited number of customers for a significant
percentage of our revenues, and any loss, cancellation,
reduction or delay in purchases by these customers could harm
our business.
A limited number of customers have, historically, consistently
accounted for a significant portion of our revenues. For
example, for the fiscal years ended March 31, 2008 and
2007, Cisco and Alcatel-Lucent accounted for 40.0% and 20.0% and
37.7% and 20.0% of revenues, respectively. Revenues from any of
our major customers may decline or fluctuate significantly in
the future. Although we are attempting to expand our customer
base, the markets in which we sell our optical components
products are dominated by a relatively small number of systems
manufacturers, thereby limiting the number of our potential
customers. Accordingly, our success will depend on our continued
ability to develop and manage relationships with significant
customers, and we expect that the majority of our revenues will
continue to depend on sales of our products to a limited number
of customers for the foreseeable future. We may not be able to
offset any decline in revenues from our existing major customers
with revenues from new customers or other existing customers.
Because of our reliance on a limited number of customers, any
decrease in revenues from, or loss of, one or more of these
customers without a corresponding increase in revenues from
other customers would harm our business, operating results and
financial condition. In addition, any negative developments in
the business of existing significant customers could result in
significantly decreased sales to these customers, which could
seriously harm our business, operating results and financial
condition.
We are
dependent on contract manufacturers for a significant portion of
our revenue.
Many of our original equipment manufacturer (OEM)
customers, including Cisco, use third party contract
manufacturers to manufacture their networking systems. These
contract manufacturers represented 54.0% and 47.0% of our total
revenue for the fiscal years ended March 31, 2008 and 2007,
respectively. Certain contract manufacturers purchase our
products directly from us on behalf of networking OEMs. Although
we work with our OEM customers in the design and development
phases of their systems, these OEM customers are gradually
giving contract manufacturers more authority in product
purchasing decisions. As a result, we depend on a concentrated
group of contract manufacturers for a significant portion of our
revenue. If we cannot compete effectively for the business of
these contract manufacturers or if any of the contract
manufacturers which work with our OEM customers experience
financial or other difficulties in their businesses, our revenue
and our business could be adversely affected.
Uncertainty
in customer forecasts of their demands and other factors may
lead to delays and disruptions in manufacturing, which could
result in delays in product shipments to customers and could
adversely affect our business.
Fluctuations and changes in our customers demand are
common in our industry. Such fluctuations, as well as quality
control problems experienced in our manufacturing operations or
those of our third-party contract manufacturers, may cause us to
experience delays and disruptions in our manufacturing process
and overall operations and reduce our output capacity. As a
result, product shipments could be delayed beyond the shipment
schedules requested by our customers or canceled, which would
negatively affect our revenues, operating income, strategic
position at customers, market share and reputation. In addition,
disruptions, delays or cancellations could cause inefficient
production which in turn could result in higher manufacturing
costs, lower yields and potential excess and obsolete inventory
or manufacturing equipment. In the past, we have experienced
such delays, disruptions and cancellations.
12
We
participate in vendor managed inventory programs for the benefit
of certain of our customers which could result in increased
inventory levels and/or decreased visibility into the timing of
revenues.
Certain of our more significant customers have implemented a
supply chain management tool called vendor managed inventory
(VMI) programs which require suppliers, such as
Opnext, to assume responsibility for maintaining an agreed upon
level of consigned inventory at the customers location or
at a third-party logistics provider, based on the
customers demand forecast. Notwithstanding the fact that
the supplier builds and ships the inventory, the customer does
not purchase the consigned inventory until the inventory is
drawn or pulled from the customer or third-party location to be
used in the manufacture of the customers product. Though
the consigned inventory may be at the customers or
third-party logistics providers physical location, it
remains inventory owned by the supplier until the inventory is
drawn or pulled, which is the time at which the sale takes
place. Our participation in VMI programs could result in our
experiencing higher levels of inventory than we might otherwise
and decrease our visibility into the timing of when our finished
goods will ultimately result in revenue generating sales.
Certain VMI programs, particularly any involving products
considered to be standard products, may require us to commit to
delivering certain quantities of our products to our customers
as consigned inventory without the customers having committed to
purchase any quantity of such products. Such VMI programs
increase the likelihood that estimates of our customers
requirements which prove to be greater than our customers
actual purchases could result in surplus inventory and we could
be required to record charges for obsolete or excess
inventories. Some of our products and supplies have in the past
become obsolete while in inventory due to rapidly changing
customer specifications or a decrease in customer demand. For
example, we incurred charges of $0.7 million and
$1.6 million, respectively, for increased excess and
obsolete inventory during the fiscal years ended March 31,
2008 and 2007, respectively. If we or our customers with which
we participate in VMI programs fail to accurately predict the
demand for our products, we could incur additional excess and
obsolete inventory write-downs. If we are unable to effectively
manage the implementation of, and proper inventory management
planning associated with, our customers VMI programs, our
financial condition and results of operations could be
materially adversely affected.
If our
customers do not qualify our products or if their customers do
not qualify their products, our results of operations may
suffer.
Most of our customers do not purchase our products prior to
qualification of our products and satisfactory completion of
factory audits and vendor evaluation. Our existing products, as
well as each new product, must pass through varying levels of
qualification with our customers. In addition, because of the
rapid technological changes in our market, a customer may cancel
or modify a design project before we begin large-scale
manufacture of the product and receive revenue from the
customer. It is unlikely that we would be able to recover the
expenses for canceled or unutilized custom design projects. It
is difficult to predict with any certainty whether our customers
will delay or terminate product qualification or the frequency
with which customers will cancel or modify their projects, but
any such delay, cancellation or modification could have a
negative effect on our results of operations.
If network service providers that purchase systems from our
customers fail to qualify or delay qualifications of any
products sold by our customers that contain our products, our
business could be harmed. The qualification and field testing of
our customers systems by network service providers is long
and unpredictable. This process is not under the control of our
company or our customers, and, as a result, timing of our
revenues is unpredictable. Any unanticipated delay in
qualification of one of our customers network systems
could result in the delay or cancellation of orders from our
customers for modules included in the applicable network system,
which could harm our results of operations.
We do
not have long-term volume purchase contracts with our customers,
so our customers may increase, decrease, cancel or delay their
buying levels at any time with minimal advance notice to us,
which may significantly harm our business.
Our customers typically purchase our products pursuant to
individual purchase orders. While our customers generally
provide us with their demand forecasts, in most cases they are
not contractually committed to buy any quantity of products
beyond firm purchase orders. Our customers may increase,
decrease, cancel or delay purchase
13
orders already in place. If any of our major customers decrease,
stop or delay purchasing our products for any reason, our
business and results of operations would be harmed. Cancellation
or delays of such orders may cause us to fail to achieve our
short and long-term financial and operating goals. In the past,
during periods of severe market downturns, certain of our
largest customers canceled significant orders with us and our
competitors which resulted in losses of revenues and excess and
obsolete inventory, that led to inventory and asset disposals
throughout the industry. Similarly, decreases or deferrals of
purchases by our customers may significantly harm our industry
and specifically our business in these and in additional
unforeseen ways, particularly if they are not anticipated.
We may
experience low manufacturing yields or higher than expected
costs.
Manufacturing yields depend on a number of factors, including
the stability and manufacturability of the product design,
manufacturing improvements gained over cumulative production
volumes, the quality and consistency of component parts and the
nature and extent of customization requirements by customers.
Higher volume demand for more mature designs requiring less
customization generally results in higher manufacturing yields
than products with lower volumes, less mature designs and
requiring extensive customization. Capacity constraints, raw
materials shortages, logistics issues, the introduction of new
product lines and changes in our customer requirements,
manufacturing facilities or processes or those of our
third-party contract manufacturers and component suppliers have
historically caused, and may in the future cause, significantly
reduced manufacturing yields, negatively impacting the gross
margins on and our production capacity for those products. Our
ability to maintain sufficient manufacturing yields is
particularly important with respect to certain products we
manufacture such as lasers and photodetectors due to the long
manufacturing process. Moreover, an increase in the rejection
and rework rate of products during the quality control process
before, during or after manufacture would result in lower
yields, gross margins and production capacity. Finally,
manufacturing yields and margins can also be lower if we receive
and inadvertently use defective or contaminated materials from
our suppliers. Because a significant portion of our
manufacturing costs is relatively fixed, manufacturing yields
may have a significant effect on our results of operations.
Lower than expected manufacturing yields could delay product
shipments and decrease our revenues and operating profit.
There
is a limited number of potential suppliers for certain
components. In addition, we depend on a limited number of
suppliers whose components have been qualified into our products
and who could disrupt our business if they stop, decrease or
delay shipments or if the components they ship have quality or
consistency issues. We may also face component shortages if we
experience increased demand for modules and components beyond
what our qualified suppliers can deliver.
Our customers generally restrict our ability to change the
component parts in our modules without their approval, which for
less critical components may require as little as a
specification comparison and for more critical components, such
as lasers, photodetectors and key integrated circuits, as much
as repeating the entire qualification process. We depend on a
limited number of suppliers of key components we have qualified
to use in the manufacture of certain of our products. Some of
these components are available only from a sole source or have
been qualified only from a single supplier. We typically have
not entered into long-term agreements with our suppliers and,
therefore, our suppliers could stop supplying materials and
equipment at any time or fail to supply adequate quantities of
component parts on a timely basis. It is difficult, costly, time
consuming and, on short notice, sometimes impossible for us to
identify and qualify new component suppliers. The reliance on a
sole supplier, single qualified vendor or limited number of
suppliers could result in delivery and quality problems, reduced
control over product pricing, reliability and performance and an
inability to identify and qualify another supplier in a timely
manner. We have in the past had to change suppliers, which has,
in some instances, resulted in delays in product development and
manufacturing until another supplier was found and qualified.
Any such delays in the future may limit our ability to respond
to changes in customer and market demands. During the last
several years, the number of suppliers of components has
decreased significantly and, more recently, demand for
components has increased rapidly. Any supply deficiencies
relating to the quality or quantities of components we use to
manufacture our products could adversely affect our ability to
fulfill customer orders and our results of operations.
14
We
rely substantially upon a limited number of contract
manufacturing partners and, if these contract manufacturers fail
to meet our short and long-term needs and contractual
obligations, our business may be negatively
impacted.
We rely on a limited number of contract manufacturers to
assemble, manufacture and test approximately half of our
finished goods. The qualification and set up of these
independent manufacturers under quality assurance standards is
an expensive and time-consuming process. Certain of our
independent manufacturers have a limited history of
manufacturing optical modules or components. In the past, we
have experienced delays or other problems, such as inferior
quality, insufficient quantity of product and an inability to
meet cost targets, which have led to delays in our ability to
fulfill customer orders. Additionally, we have, in the past,
been required to qualify new contract manufacturing partners and
replace contract manufacturers, which led to delays in
deliveries. Any future interruption in the operations of these
manufacturers, or any deficiency in the quality, quantity or
timely delivery of the components or products built for us by
these manufacturers, could impede our ability to meet our
scheduled product deliveries to our customers or require us to
contract with and qualify new contract manufacturing partners.
As a result, we may lose existing or potential customers or
orders and our business may be negatively impacted.
We
depend on facilities located outside of the United States to
manufacture our products, which subjects us to additional
risks.
In addition to our principal manufacturing facilities in Japan,
we rely on contract manufacturers located in Asia and elsewhere
for our supply of key products and we intend to expand our use
of contract manufacturers outside of Japan. Each of these
facilities and manufacturers subjects us to additional risks
associated with international manufacturing, including:
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unexpected changes in regulatory requirements;
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legal uncertainties regarding liabilities, tariffs and other
trade barriers;
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inadequate protection of intellectual property in some countries;
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greater incidence of shipping delays;
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greater difficulty in overseeing manufacturing operations,
including, but not limited to, the levels of inventory
associated therewith;
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greater difficulty in hiring talent needed to oversee
manufacturing operations;
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potential political and economic instability; and
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the outbreak of infectious diseases which could result in travel
restrictions or the closure of our facilities or the facilities
of our customers and suppliers.
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Any of these factors could significantly impair our ability to
source our contract manufacturing requirements internationally.
We
face increasing competition from other providers of competing
products, which could negatively impact our results of
operations and market share.
We believe that a number of companies have developed or are
developing transmit and receive optical modules and components
and lasers and infrared LEDs that compete directly with our
product offerings. Current and potential competitors may have
substantially greater financial, marketing, research and
manufacturing resources than we possess, and there can be no
assurance that our current and future competitors will not be
more successful than us in specific product lines or as a whole.
Competition has intensified as additional competitors enter the
market and current competitors expand their product lines. The
industry has experienced an increase in low-cost providers of
certain product lines. Companies competing with us may introduce
products that are more competitively priced, have greater
performance, functionality or reliability, or our competitors
may have stronger customer relationships, and may be able to
react quicker to changing customer requirements and
expectations. Increased competitive pressure has in the past
15
and may in the future result in a loss of sales or market share
or cause us to lower prices for our products, any of which would
harm our business and operating results. To attract new
customers or retain existing customers, we may offer certain
customers favorable prices on our products. A reduction in
pricing for any existing or future customers may result in
reduced pricing for other existing or future customers since our
customers pricing is established pursuant to pricing
agreements of not more than one year in duration or upon receipt
of purchase orders. All of the pricing agreements with our
customers provide either that prices will be set at invoicing or
at various intervals during the year or require us to offer our
existing customers the most favorable pricing terms. All of
these situations enable our customers to frequently negotiate
based upon prevailing market price trends. As product prices
decline, our average selling prices and operating profits would
decline.
Decreases
in average selling prices of our products may reduce operating
profit and net income, particularly if we are not able to reduce
our expenses commensurately.
The market for optical components continues to be characterized
by declining average selling prices resulting from factors such
as increased price competition among optical component
manufacturers, excess capacity, the introduction of new products
and increased unit volumes as manufacturers continue to deploy
network and storage systems. We anticipate that average selling
prices will decrease in the future in response to product
introductions by our competitors or us, or in response to other
factors, including price pressures from significant customers.
In order to sustain profitable operations, we must, therefore,
continue to develop and introduce new products on a timely basis
that incorporate features that can be sold at higher average
selling prices. Failure to do so could cause our revenues and
operating profit to decline.
In the current environment of declining average selling prices,
we must continually seek ways to reduce our costs to maintain
our operating profit and net income. Our cost reduction efforts
may not allow us to keep pace with competitive pricing
pressures. To remain competitive, we must continually reduce the
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