Kulicke and Soffa Industries, Inc. designs, manufactures, and markets semiconductor wire bonding assembly equipment and packaging materials, as well as service, maintain, repair, and upgrade equipment that are used to assemble semiconductor devices. It has two segments, Equipment and Packaging Materials. The Equipment segment offers a line of wire bonders and die bonders. Its wire bonders are used to connect very fine wires, primarily made of gold, aluminum, or copper, between the bond pads of a semiconductor die and the leads on the integrated circuit (IC) package; and die bonders perform the task of removing a semiconductor die from a previously cut/separated wafer and placing it onto a...